Zhuzhou Teyou New Material Co.,Ltd
Zhuzhou Teyou New Material Co.,Ltd Tungsten Heavy Alloy factory
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WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 30 wt.% Cu
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low porosity
Description:
Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.