Zhuzhou Teyou New Material Co.,Ltd
Zhuzhou Teyou New Material Co.,Ltd Tungsten Heavy Alloy factory
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WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 15 wt.% Cu
Description:
Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Advantages:
1. Excellent hermeticity
2. Semi-finished or finished (Ni/Au plated) products available
3. Low porosity
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |